Masamitsu Agari
44Patents
2h-index
14Co-inventors
46Inventor score
Filing activity: Sep 20, 2017 → Jul 21, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10438898B2 | Wafer processing method | Electricity | 2 | Active |
| US10847420B2 | Wafer processing method | Electricity | 2 | Active |
| US11037814B2 | Wafer processing method using a ring frame with a polyester sheet with no adhesive layer | Electricity | 1 | Active |
| US11289379B2 | Wafer processing method | Electricity | 1 | Active |
| US10991624B2 | Wafer processing method including applying a polyolefin sheet to a wafer | Electricity | 1 | Active |
| US10297501B2 | Method for dividing wafer into individual chips | Electricity | 1 | Active |
| US11062948B2 | Wafer processing method | Electricity | 1 | Active |
| US11049772B2 | Wafer processing method including applying a polyester sheet to a wafer | Electricity | 0 | Active |
| US11380587B2 | Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer | Electricity | 0 | Active |
| US11610815B2 | Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer | Emerging Cross-Sectional Technologies | 0 | Active |
| US11043421B2 | Wafer processing method | Electricity | 0 | Active |
| US11031234B2 | Wafer processing method including applying a polyolefin sheet to a wafer | Electricity | 0 | Active |
| US10720355B2 | Wafer processing method | Electricity | 0 | Active |
| US11587832B2 | Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer | Electricity | 0 | Active |
| US11056334B2 | Wafer processing method using a ring frame and a polyester sheet | Electricity | 0 | Active |
| US10998232B2 | Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheet | Electricity | 0 | Active |
| US11004744B2 | Wafer processing method for dividing a wafer along predefined division lines | Electricity | 0 | Active |
| US10985067B2 | Wafer processing method using a laser beam dividing step | Electricity | 0 | Active |
| US10896850B2 | Wafer processing method | Electricity | 0 | Active |
| US10847404B2 | Sheet sticking method | Electricity | 0 | Active |
| US10985066B2 | Wafer processing method for dividing a wafer along division lines | Electricity | 0 | Active |
| US11380588B2 | Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer | Electricity | 0 | Active |
| US11322406B2 | Wafer processing method | Electricity | 0 | Active |
| US10991587B2 | Wafer processing method including applying a polyester sheet to a wafer | Electricity | 0 | Active |
| US11018058B2 | Wafer processing method for dividing a wafer along predefined division lines using polyester sheet | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.