Apparatus with multi-wafer based device and method for forming such
US11037817B2 · kind B2 · utility
2Cited by
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16Claims
0Family size
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Key dates
| Filing date | Mar 30, 2017 |
| Grant date | Jun 15, 2021 |
| Priority date | — |
| Expiry date | Mar 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L24/17
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus is provided which comprises: a substrate; one or more active devices adjacent to the substrate; a first set of one or more layers to interconnect the one or more active devices; a second set of one or more layers; and a layer adjacent to one of the layers of the first and second sets, wherein the layer is to bond the one of the layers of the first and second sets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.