Apparatus with multi-wafer based device comprising embedded active devices and method for forming such
US11037916B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Mar 30, 2017 |
| Grant date | Jun 15, 2021 |
| Priority date | — |
| Expiry date | Mar 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06527
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus is provided which comprises: a substrate; a first active device adjacent to the substrate; a first set of one or more layers to interconnect the one or more active devices; a second set of one or more layers; a second active device coupled to the second set of one or more layers; and a layer adjacent to one of the layers of the first set and the second active device, wherein the layer is to bond the one of the layers of the first set and the second active device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.