Systems for removing and replacing consumable parts from a semiconductor process module in situ

US11112773B2 · kind B2 · utility

Assignee

• Lam Research Corporation · US

Inventors

• David Trussell · Fremont, US
• Alan J. Miller · Fremont, US
• John Daugherty · Fremont, US
• Alex Paterson · San Jose, US

Key dates

• Filing date: Aug 2, 2017
• Grant date: Sep 7, 2021
• Expiry date: Oct 24, 2037

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P90/02
• WIPO field: Control
• WIPO sector: Instruments

Abstract

A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module. The lift mechanism is configured to receive the consumable part provided for replacement by the exchange handler and lower the consumable part to an installed position. The replacement by the exchange handler…