System and method for optimizing a lithography exposure process
US11126096B2 · kind B2 · utility
1Cited by
29References
36Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 28, 2018 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Sep 28, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7003
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.