Semiconductor assemblies including thermal circuits and methods of manufacturing the same
US11171118B2 · kind B2 · utility
1Cited by
3References
21Claims
0Family size
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Inventors
Key dates
| Filing date | Jul 3, 2019 |
| Grant date | Nov 9, 2021 |
| Priority date | — |
| Expiry date | Jul 3, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor assemblies including thermal layers and associated systems and methods are disclosed herein. In some embodiments, the semiconductor assemblies comprise one or more semiconductor devices over a substrate. The substrate includes a thermal layer configured to transfer thermal energy along a lateral plane and across the substrate. The thermal energy is transferred along a non-lateral direction from the semiconductor device to the graphene layer using one or more thermal connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.