Method and apparatuses for reducing porogen accumulation from a UV-cure chamber
US11177131B2 · kind B2 · utility
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118References
20Claims
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Key dates
| Filing date | Jul 6, 2018 |
| Grant date | Nov 16, 2021 |
| Priority date | — |
| Expiry date | Jan 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Porogen accumulation in a UV-cure chamber is reduced by removing outgassed porogen through a heated outlet while purge gas is flowed across a window through which a wafer is exposed to UV light. A purge ring having specific major and minor exhaust to inlet area ratios may be partially made of flame polished quartz to improve flow dynamics. The reduction in porogen accumulation allows more wafers to be processed between chamber cleans, thus improving throughput and cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.