Proximity contact cover ring for plasma dicing
US11195756B2 · kind B2 · utility
0Cited by
66References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2014 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Sep 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Methods of and carriers for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a cover ring for protecting a carrier and substrate assembly during an etch process includes an inner opening having a diameter smaller than the diameter of a substrate of the carrier and substrate assembly. An outer frame surrounds the inner opening. The outer frame has a bevel for accommodating an outermost portion of the substrate of the carrier and substrate assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.