Semiconductor device including an antenna
US11195787B2 · kind B2 · utility
4Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2016 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Feb 17, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q9/265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.