Patent · US Active

In-situ full wafer metrology system

US11204312B2 · kind B2 · utility

0Cited by

1References

17Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Ami Sade · Nahariah, IL
Todd Egan · Fremont, US
Shay Assaf · Santa Clara, US
Jacob Newman · Palo Alto, US

Key dates

Filing date	Mar 13, 2020
Grant date	Dec 21, 2021
Priority date	—
Expiry date	Mar 13, 2040

Classification

Technology area (CPC G)Physics
CPC primaryG01N2021/0106
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Full wafer in-situ metrology chambers and methods of use are described. The metrology chambers include a substrate support and a sensor bar that are rotatable relative to each other. The sensor bar includes a plurality of sensors at different radii from a central axis.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.