Substrate processing apparatus
US11208721B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2018 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Nov 1, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68771
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate processing apparatus includes an inner tube configured to accommodate a plurality of substrates and having a first opening portion; an outer tube surrounding the inner tube; a movable wall movably provided in the inner tube or between the inner tube and the outer tube and having a second opening portion; a gas supply part configured to supply a processing gas into the inner tube; an exhaust part provided outside the movable wall and configured to exhaust the processing gas supplied into the inner tube through the first opening portion and the second opening portion; and a pressure detection part configured to detect a pressure inside the inner tube.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.