Electrostatic chucking pedestal with substrate backside purging and thermal sinking
US11232966B2 · kind B2 · utility
0Cited by
1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2018 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | Nov 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic substrate chuck with substrate backside purging to prevent incidental backside deposition and that provides thermal sinking to prevent or mitigate the failure of seals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.