Methods of embedding magnetic structures in substrates
US11251113B2 · kind B2 · utility
1Cited by
1References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 27, 2017 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Jun 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/086
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods/structures of forming embedded inductor structures are described. Embodiments include forming a first interconnect structure on a dielectric material of a substrate, selectively forming a magnetic material on a surface of the first interconnect structure, forming an opening in the magnetic material, and forming a second interconnect structure in the opening. Build up layers are then formed on the magnetic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.