Substrate processing method and substrate processing apparatus
US11260431B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 25, 2020 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Aug 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing method includes a processing liquid supplying step of supplying a processing liquid having a solute and a solvent to a front surface of a substrate, a processing film forming step of forming on the front surface of the substrate a processing film which holds a removal object present on the front surface of the substrate by solidifying or curing the processing liquid supplied to the front surface of the substrate, and a peeling step of peeling the processing film from the front surface of the substrate together with the removal object by supplying a peeling liquid to the front surface of the substrate, and the peeling step includes a penetrating hole forming step of forming a penetrating hole on the processing film by dissolving partially the processing film in the peeling liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.