Clips for semiconductor package and related methods
US11264311B2 · kind B2 · utility
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20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2019 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Apr 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Implementations of a clip may include a first copper layer directly bonded to a first side of a ceramic layer, a second copper layer directly bonded to a second side of the ceramic layer, the second side of the ceramic layer opposite the first side of the ceramic layer, and a plurality of channels partially etched into a thickness of the second copper layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.