Jooyang EOM
8Patents
1h-index
5Co-inventors
36Inventor score
Filing activity: Nov 7, 2019 → Apr 11, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11430777B2 | Power module package for direct cooling multiple power modules | Electricity | 1 | Active |
| US11984424B2 | Semiconductor packages using package in package systems and related methods | Electricity | 1 | Active |
| US12230601B2 | High power module package structures | Electricity | 0 | Active |
| US11848320B2 | Power module package for direct cooling multiple power modules | Electricity | 0 | Active |
| US11264311B2 | Clips for semiconductor package and related methods | Electricity | 0 | Active |
| US12205918B2 | Submodule semiconductor package | Electricity | 0 | Active |
| US12417999B2 | Semiconductor packages using package in package systems and related methods | Electricity | 0 | Active |
| US12308364B2 | Power module package for direct cooling multiple power modules | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.