Interposers for microelectronic devices
US11264332B2 · kind B2 · utility
2Cited by
8References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2019 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Feb 7, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described are semiconductor interposer, and microelectronic device assemblies incorporating such semiconductor interposers. The described interposers include multiple redistribution structures on each side of the core; each of which may include multiple individual redistribution layers. The interposers may optionally include circuit elements, such as passive and/or active circuit. The circuit elements may be formed at least partially within the semiconductor core.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.