Patent · US Active

Batch manufacture of packages by sheet separated into carriers after mounting of electronic components

US11264356B2 · kind B2 · utility

0Cited by

8References

21Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thorsten Meyer · Regensburg, DE
Thomas Behrens · Madison, US
Andreas Grassmann · Villach, AT
Martin Gruber · Schwandorf, DE
Thorsten Scharf · Regensburg, DE

Key dates

Filing date	Apr 7, 2020
Grant date	Mar 1, 2022
Priority date	—
Expiry date	Apr 7, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/97
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of manufacturing packages is disclosed. In one example, the method comprises providing an electrically conductive sheet being continuous at least in a mounting region, mounting first main surfaces of a plurality of electronic components on the continuous mounting region of the sheet and forming interconnect structures for electrically coupling second main surfaces of the electronic components with the sheet. The second main surfaces oppose the first main surfaces. After the forming, structuring the sheet.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.