Deep trench capacitor distribution
US11296093B2 · kind B2 · utility
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4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2020 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Mar 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/68
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for distributing deep trench (DT) capacitance in an integrated circuit (IC) design is provided. The method includes forming a placement block that includes blockages defining openings in interstitial regions among the blockages, superimposing the placement block over the IC design and providing distributed DT capacitance to the IC design. The providing of the distributed DT capacitance includes adding DT capacitance cells through the openings to portions of the IC design where there are no reserved blocks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.