Grounding mechanism for multi-layer for electrostatic chuck, and related methods
US11309207B2 · kind B2 · utility
1Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2020 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Jul 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described are multi-layer electrostatic chucks used to secure and support a wafer substrate during wafer processing, and related methods, wherein the chuck includes a grounding structure that includes a grounding layer and a grounding pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.