Method for bonding substrates
US11315901B2 · kind B2 · utility
1Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2017 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Oct 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.