Patent · US Active

Multi-die stacks with power management

US11320883B2 · kind B2 · utility

2Cited by

2References

27Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Rajashree Baskaran · Seattle, US
Maruti Gupta Hyde · Portland, US
Min Suet Lim · Kampung Bukit Kechil, MY
Van H. Le · Portland, US
Hebatallah Saadeldeen · San Jose, US

Key dates

Filing date	Sep 28, 2018
Grant date	May 3, 2022
Priority date	—
Expiry date	Dec 20, 2038

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02D10/00
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Methods and apparatus to provide power management for multi-die stacks using artificial intelligence are disclosed. An example multi-die package includes a computer processor unit (CPU) die, a memory die stacked in vertical alignment with the CPU die, and artificial intelligence (AI) architecture circuitry to infer a workload for at least one of the CPU die or the memory die. The AI architecture circuitry is to manage power consumption of at least one of the CPU die or the memory die based on the inferred workload.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.