Methods, apparatuses and systems for substrate processing for lowering contact resistance
US11328929B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2019 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Oct 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/05624
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods, apparatuses, and systems for substrate processing for lowering contact resistance in at least contact pads of a semiconductor device are provided herein. In some embodiments, a method of substrate processing for lowering contact resistance of contact pads includes: circulating a cooling fluid in at least one channel of a pedestal; and exposing a backside of the substrate located on the pedestal to a cooling gas to cool a substrate located on the pedestal to a temperature of less than 70 degrees Celsius. In some embodiments in accordance with the present principles, the method can further include distributing a hydrogen gas or hydrogen gas combination over the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.