Magnetic inductor structures for package devices

US11335632B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Prithwish Chatterjee · Tempe, US
• Junnan Zhao · Gilbert, US
• Sai Vadlamani · Chandler, US
• Ying Wang · Taichung, TW
• Rahul Jain · Chandler, US
• Andrew J. Brown · Brier, US
• Lauren A. Link · Mesa, US
• Cheng Xu · Chandler, US
• Sheng Li · Santa Clara, US

Key dates

• Filing date: Dec 28, 2017
• Grant date: May 17, 2022
• Expiry date: Jul 28, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19102
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Methods/structures of forming in-package inductor structures are described. Embodiments include a substrate including a dielectric material, the substrate having a first side and a second side. A conductive trace is located within the dielectric material. A first layer is on a first side of the conductive trace, wherein the first layer comprises an electroplated magnetic material, and wherein a sidewall of the first layer is adjacent the dielectric material. A second layer is on a second side of the conductive trace, wherein the second layer comprises the electroplated magnetic material, and wherein a sidewall of the second layer is adjacent the dielectric material.