Preclean and encapsulation of microLED features
US11342481B2 · kind B2 · utility
2Cited by
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19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2020 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Sep 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/852
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method for cleaning and encapsulating microLED features are disclosed. Some embodiments provide for a wet clean process and a dry clean process to remove contaminants from the microLED feature. Some embodiments provide for the encapsulation of a clean microLED feature. Some embodiments provide improved crystallinity of the microLED feature and the capping layer. Some embodiments provide improved EQE of microLED devices formed from the disclosed microLED features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.