Methods and systems for inspection of wafers and reticles using designer intent data
US11348222B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2019 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Apr 22, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the water in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.