Patent · US Active

Fluid recovery in semiconductor processing

US11352711B2 · kind B2 · utility

0Cited by

0References

18Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Sam Lee · Kalispell, US
Kyle M. Hanson · Kalispell, US
Eric J. Bergman · Kalispell, US

Key dates

Filing date	Jul 16, 2019
Grant date	Jun 7, 2022
Priority date	—
Expiry date	Jun 25, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/6723
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Cleaning substrates or electroplating system components may include methods of rinsing a substrate at a semiconductor plating chamber. The methods may include moving a head from a plating bath to a first position. The head may include a substrate coupled with the head. The methods may include rotating the head for a first period of time to sling bath fluid back into the plating bath. A residual amount of bath fluid may remain. The methods may include delivering a first fluid to the substrate from a first fluid nozzle to at least partially expel the residual amount of bath fluid back into the plating bath. The methods may include moving the head to a second position. The methods may include rotating the head for a second period of time. The methods may also include delivering a second fluid across the substrate from a second fluid nozzle.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.