Antenna package using ball attach array to connect antenna and base substrates
US11355849B2 · kind B2 · utility
2Cited by
4References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2017 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Aug 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6677
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In accordance with disclosed embodiments, there is an antenna package using a ball attach array to connect an antenna and base substrates of the package. One example is an RF RF module package including an RF antenna package having a stack material in between a top and a bottom antenna layer to form multiple antenna plane surfaces, a base package having alternating patterned conductive and dielectric layers to form routing through the base package, and a bond between a bottom surface of the antenna package and to a top surface of the base package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.