Patent · US Active

Patch antennas stitched to systems in packages and methods of assembling same

US11374323B2 · kind B2 · utility

0Cited by

1References

15Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Andreas Augustin · Munich, DE
Sonja Koller · Regensburg, DE
Bernd Waidhas · Nittendorf, DE
Georg Seidemann · Landshut, DE
Andreas Wolter · Regensburg, DE
Stephan Stoeckl · Schwandorf, DE
Thomas Wagner · Regelsbach, DE
Josef Hagn · Neubiberg, DE

Key dates

Filing date	Mar 31, 2017
Grant date	Jun 28, 2022
Priority date	—
Expiry date	Nov 4, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

A patch antenna array is fabricated with a package-on-package setup that contains a transceiver. The patch antenna array has a footprint that intersects the transceiver footprint. The package-on-package setup includes through-mold vias that couple to a redistribution layer disposed between the patch antennas and the package-on-package setup.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.