Substrate support carrier with improved bond layer protection
US11380572B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2020 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Oct 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67376
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate support pedestal comprises an electrostatic chuck, a cooling base, a gas flow passage, a porous plug, and a sealing member. The electrostatic chuck comprises body having a cavity. The cooling base is coupled to the electrostatic chuck via a bond layer. The gas flow passage is formed between a top surface of the electrostatic chuck and a bottom surface of the cooling base. The gas flow passage further comprises the cavity. The porous plug is positioned within the cavity to control the flow of gas through the gas flow passage. The sealing member is positioned adjacent to the porous plug and is configured to form one or more of a radial seal between the porous plug and the cavity and an axial seal between the porous plug and the cooling base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.