Patent · US Active

Method and related structure to authenticate integrated circuit with authentication film

US11380622B2 · kind B2 · utility

0Cited by

5References

18Claims

0Family size

Assignee

GLOBALFOUNDRIES U.S. Inc. · US

Inventors

Vibhor Jain · Williston, US
Sunil Kumar Singh · Mechanicville, US
Johnatan A. Kantarovsky · South Burlington, US
Siva P. Adusumilli · South Burlington, US
Sebastian T. Ventrone · South Burlington, US
John J. Ellis-Monaghan · Grand Isle, US
Yves T. Ngu · Butlers Corners, US

Key dates

Filing date	Nov 20, 2020
Grant date	Jul 5, 2022
Priority date	—
Expiry date	Nov 20, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2223/54433
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The disclosure provides a method to authenticate an integrated circuit (IC) structure. The method may include forming a first authentication film (AF) material within the IC structure. A composition of the first AF material is different from an adjacent material within the IC structure. The method includes converting the first AF material into a void within the IC structure. Additionally, the method includes creating an authentication map of the IC structure to include a location of the void in the IC structure for authentication of the IC structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.