Inventor · Mechanicville, NY, US

Sunil Kumar Singh

62Patents
7h-index
86Co-inventors
75Inventor score

Filing activity: Dec 8, 1998 → Dec 26, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US6325808A Robotic system, docking station, and surgical tool for collaborative control in minimally invasive surgery Human Necessities 741 Expired
US8652962B2 Etch damage and ESL free dual damascene metal interconnect Electricity 19 Active
US10312188B1 Interconnect structure with method of forming the same Electricity 13 Active
US9117822B1 Methods and structures for back end of line integration Electricity 9 Active
US10347528B1 Interconnect formation process using wire trench etch prior to via etch, and related interconnect Electricity 8 Active
US9576894B2 Integrated circuits including organic interlayer dielectric layers and methods for fabricating the same Electricity 7 Active
US7682963B2 Air gap for interconnect application Electricity 7 Active
US9786549B2 Etch damage and ESL free dual damascene metal interconnect Electricity 6 Active
US9524935B2 Filling cavities in an integrated circuit and resulting devices Electricity 6 Active
US9142451B2 Reduced capacitance interlayer structures and fabrication methods Electricity 5 Active
US10084093B1 Low resistance conductive contacts Electricity 5 Active
US11515205B2 Conductive structures for contacting a top electrode of an embedded memory device and methods of making such contact structures on an IC product Electricity 4 Active
US9093501B2 Interconnection wires of semiconductor devices Electricity 3 Active
US10177029B1 Integration of air gaps with back-end-of-line structures Electricity 3 Active
US9362162B2 Methods of fabricating BEOL interlayer structures Electricity 3 Active
US9691654B1 Methods and devices for back end of line via formation Electricity 3 Active
US8778794B1 Interconnection wires of semiconductor devices Electricity 2 Active
US6485975B1 Method for regenerating viable and fertile citrus plants by tissue culture from explants Chemistry; Metallurgy 2 Expired
US10312136B2 Etch damage and ESL free dual damascene metal interconnect Electricity 2 Active
US9318377B2 Etch damage and ESL free dual damascene metal interconnect Electricity 2 Active
US9353114B2 Process for the preparation of dipeptidylpeptidase inhibitors Chemistry; Metallurgy 1 Active
US10504774B2 Lithographic patterning to form fine pitch features Electricity 1 Active
US11171041B2 Etch damage and ESL free dual damascene metal interconnect Electricity 1 Active
US10886287B2 Multiple-time programmable (MTP) memory device with a wrap-around control gate Electricity 0 Active
US9741605B2 Reducing defects and improving reliability of BEOL metal fill Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.