Patent · US Active

Wafer chuck and processing arrangement

US11387081B2 · kind B2 · utility

0Cited by

1References

9Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Rudolf Kogler · Sankt Veit in der Gegend, AT
Juergen Steinbrenner · Zistersdorf, AT
Wolfgang Dastel · Villach, AT
Harald Huetter · Baldramsdorf, AT
Markus Kahn · Rangersdorf, AT

Key dates

Filing date	Feb 24, 2020
Grant date	Jul 12, 2022
Priority date	—
Expiry date	Feb 24, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/338
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

According to various embodiments, a wafer chuck may include at least one support region configured to support a wafer in a receiving area; a central cavity surrounded by the at least one support region configured to support the wafer only along an outer perimeter; and a boundary structure surrounding the receiving area configured to retain the wafer in the receiving area.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.