Patent · US Active

Process kit for a substrate support

US11387134B2 · kind B2 · utility

1Cited by

8References

19Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Muhannad Mustafa · Milpitas, US
Muhammad M. Rasheed · San Jose, US
Yu Lei · Belmont, US
Avgerinos V. Gelatos · Scotts Valley, US
Vikash Banthia · Los Altos, US
Victor H Calderon · Sunnyvale, US
Shi Wei Toh · Mountain View, US
Yung-Hsin Lee · San Jose, US
Anindita Sen · San Jose, US

Key dates

Filing date	Jan 16, 2019
Grant date	Jul 12, 2022
Priority date	—
Expiry date	Aug 7, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/3344
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Methods and apparatus for processing substrates are provided herein. In some embodiments, a process kit for a substrate support includes: an upper edge ring made of quartz and having an upper surface and a lower surface, wherein the upper surface is substantially planar and the lower surface includes a stepped lower surface to define a radially outermost portion and a radially innermost portion of the upper edge ring.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.