Device, system and method for providing inductor structures
US11387198B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2017 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Sep 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Techniques and mechanisms for providing an inductor with an integrated circuit (IC) die. In an embodiment, the IC die comprises integrated circuitry and one or more first metallization layers. The IC die is configured to couple to a circuit device including one or more second metallization layers, where such coupling results in the formation of an inductor which is coupled to the integrated circuitry. One or more loop structures of the inductor each span both some or all of the one or more first metallization layers and some or all of the one or more second metallization layers. In another embodiment, the IC die or the circuit device includes a ferromagnetic material to concentrate a magnetic flux which is provided with the inductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.