Patent · US Active

Semiconductor package with plastic waveguide

US11387533B2 · kind B2 · utility

0Cited by

3References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Maciej Wojnowski · Munich, DE
Dirk Hammerschmidt · Villach, AT
Walter Hartner · Munich, DE
Johannes Lodermeyer · Kinding, DE
Chiara Mariotti · Villach, AT
Thorsten Meyer · Regensburg, DE

Key dates

Filing date	Jul 11, 2018
Grant date	Jul 12, 2022
Priority date	—
Expiry date	Jul 11, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/73267
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

A semiconductor device including an Integrated Circuit (IC) package and a plastic waveguide. The IC package includes a semiconductor chip; and an embedded antenna formed within a Redistribution Layer (RDL) coupled to the semiconductor chip, wherein the RDL is configured to transport a Radio Frequency (RF) signal between the semiconductor chip and the embedded antenna. The plastic waveguide is attached to the IC package and configured to transport the RF signal between the embedded antenna and outside of the IC package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.