Apparatus and method for controlling a flow process material to a deposition chamber

US11393703B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Alexander Lerner · Carmiel, IL
• Roey Shaviv · Palo Alto, US
• Phillip Stout · Santa Clara, US
• Joseph M. Ranish · San Jose, US
• Prashanth Kothnur · San Jose, US
• Satish Radhakrishnan · San Jose, US

Key dates

• Filing date: Jun 16, 2019
• Grant date: Jul 19, 2022
• Expiry date: Dec 2, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67115
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Methods and apparatus for controlling a flow of process material to a deposition chamber. In embodiments, the apparatus includes a deposition chamber in fluid communication with one or more sublimators through one or more delivery lines, wherein the one or more sublimators each include an ampoule in fluid communication with the one or more delivery lines through an opening, and at least a first heat source and a second heat source, wherein the first heat source is a radiant heat source adjacent the ampoule and a second heat source is adjacent the opening, wherein the one or more delivery lines include one or more conduits between the deposition chamber and the one or more sublimators, and wherein the one or more conduits include one or more valves to open or close the one or more conduits, wherein the one or more valves in an open position prevents the flow of process material into the deposition chamber, and wherein the one or more valves in a closed position directs the flow of process material into the deposition chamber.