Wafer transport assembly with integrated buffers

US11393705B2 · kind B2 · utility

Assignee

• Lam Research Corporation · US

Inventors

• John Daugherty · Fremont, US
• David Trussell · Fremont, US
• Michael C. Kellogg · Fremont, US
• Christopher Pena · Hayward, US
• Richard H. Gould · Fremont, US
• Klay Kunkel · Sunol, US

Key dates

• Filing date: Sep 18, 2020
• Grant date: Jul 19, 2022
• Expiry date: Sep 18, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67769
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.