Formation of tall metal pillars using multiple photoresist layers
US11393762B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Mar 30, 2017 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Mar 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0733
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus system is provided which comprises: a substrate; a metal pillar formed on the substrate, the metal pillar comprising a first section and a second section, wherein the first section of the metal pillar is formed by depositing metal in a first opening of a first photoresist layer, and wherein the second section of the metal pillar is formed by depositing metal in a second opening of a second photoresist layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.