Retaining ring design

US11400560B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Jeonghoon Oh · San Jose, US
• Charles C. Garretson · Sunnyvale, US
• Eric Lau · Santa Clara, US
• Andrew J. Nagengast · Sunnyvale, US
• Steven M. Zuniga · Soquel, US
• Edwin C. Suarez · Pleasanton, US
• Huanbo Zhang · San Jose, US
• Brian J. Brown · Eastleigh, GB

Key dates

• Filing date: Oct 2, 2018
• Grant date: Aug 2, 2022
• Expiry date: Jun 3, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/687
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.