Die sidewall coatings and related methods
US11404277B2 · kind B2 · utility
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5References
7Claims
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Assignee
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Key dates
| Filing date | May 20, 2020 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Oct 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10156
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various implementations of a method of forming a semiconductor package may include forming a plurality of notches into the first side of a semiconductor substrate; applying a permanent coating material into the plurality of notches; forming a first organic material over the first side of the semiconductor substrate and the plurality of notches; thinning a second side of the semiconductor substrate opposite the first side one of to or into the plurality of notches; and singulating the semiconductor substrate through the permanent coating material into a plurality of semiconductor packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.