Package comprising a substrate configured as a heat spreader
US11404343B2 · kind B2 · utility
0Cited by
5References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2020 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Feb 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package that includes a first substrate, an integrated device coupled to the first substrate, a second substrate coupled to the integrated device, and an encapsulation layer located between the first substrate and the second substrate. The second substrate is configured to operate as a heat spreader. The second substrate is configured to be free of an electrical connection with the integrated device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.