Batch curing chamber with gas distribution and individual pumping
US11408075B2 · kind B2 · utility
0Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2018 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Sep 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure generally relate to a batch processing chamber that is adapted to simultaneously cure multiple substrates at one time. The batch processing chamber includes multiple processing sub-regions that are each independently temperature controlled. The batch processing chamber may include a first and a second sub-processing region that are each serviced by a substrate transport device external to the batch processing chamber. In addition, a slotted cover mounted on the loading opening of the batch curing chamber reduces the effect of ambient air entering the chamber during loading and unloading.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.