Inventor · Fremont, CA, US

Qiwei Liang

73Patents
17h-index
70Co-inventors
87Inventor score

Filing activity: Apr 15, 1999 → Nov 29, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US6326597A Temperature control system for process chamber Electricity 603 Expired
US7989365B2 Remote plasma source seasoning Emerging Cross-Sectional Technologies 599 Active
US6598559B1 Temperature controlled chamber Chemistry; Metallurgy 536 Expired
US9132436B2 Chemical control features in wafer process equipment Electricity 197 Active
US9144147B2 Semiconductor processing system and methods using capacitively coupled plasma Electricity 182 Active
US8357435B2 Flowable dielectric equipment and processes Electricity 156 Active
US8894767B2 Flow control features of CVD chambers Emerging Cross-Sectional Technologies 105 Active
US9978564B2 Chemical control features in wafer process equipment Electricity 105 Active
US10269541B2 Workpiece processing chamber having a thermal controlled microwave window Electricity 65 Active
US10354843B2 Chemical control features in wafer process equipment Electricity 38 Active
US10283321B2 Semiconductor processing system and methods using capacitively coupled plasma Electricity 35 Active
US10179941B1 Gas delivery system for high pressure processing chamber Electricity 27 Active
US10675581B2 Gas abatement apparatus Performing Operations; Transporting 18 Active
US10720341B2 Gas delivery system for high pressure processing chamber Electricity 18 Active
US10529603B2 High pressure wafer processing systems and related methods Electricity 17 Active
US10224224B2 High pressure wafer processing systems and related methods Electricity 17 Active
US6894474B2 Non-intrusive plasma probe Electricity 17 Expired
US10615007B2 Plasma reactor with non-power-absorbing dielectric gas shower plate assembly Electricity 16 Active
US10748783B2 Gas delivery module Electricity 16 Active
US10203604B2 Method and apparatus for post exposure processing of photoresist wafers Electricity 13 Active
US7510624B2 Self-cooling gas delivery apparatus under high vacuum for high density plasma applications Electricity 12 Expired
US10358715B2 Integrated cluster tool for selective area deposition Electricity 11 Active
US9733579B2 Tooling configuration for electric/magnetic field guided acid profile control in a photoresist layer Physics 9 Active
US6508198B1 Automatic tuning in a tapped RF transformer inductive source of a plasma reactor for processing a semiconductor wafer Electricity 8 Expired
US9905400B2 Plasma reactor with non-power-absorbing dielectric gas shower plate assembly Electricity 8 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.