Processing system for forming layers

US11414740B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Alexander Lerner · Carmiel, IL
• Roey Shaviv · Palo Alto, US
• Michael P. Karazim · San Jose, US
• Kevin Moraes · Fremont, US
• Steven V. Sansoni · Livermore, US
• Andrew J. Constant · Cupertino, US
• Jeffrey A. Brodine · Los Gatos, US
• Kim Vellore · San Jose, US
• Amikam Sade · Cupertino, US
• Niranjan Kumar · Bengaluru, IN

Key dates

• Filing date: May 1, 2020
• Grant date: Aug 16, 2022
• Expiry date: May 1, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K30/88
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Embodiments of the present disclosure generally relate to a processing system for forming one or more layers of a photodiode. In one embodiment, the processing system includes a transfer chamber, a plurality of processing chambers, and a controller configured to cause a process to be performed in the processing system. The process includes performing a pre-clean process on a substrate, aligning and placing a first mask on the substrate, depositing a first layer on the substrate, and depositing a second layer on the substrate. The processing system can form layers of a photodiode in a low defect, cost effective, and high utilization manner.