Methods and apparatus for monitoring a lithographic manufacturing process
US11422476B2 · kind B2 · utility
1Cited by
34References
20Claims
0Family size
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Key dates
| Filing date | Oct 2, 2020 |
| Grant date | Aug 23, 2022 |
| Priority date | — |
| Expiry date | Oct 2, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70691
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for monitoring a lithographic process, and associated lithographic apparatus. The method includes obtaining height variation data relating to a substrate supported by a substrate support and fitting a regression through the height variation data, the regression approximating the shape of the substrate; residual data between the height variation data and the regression is determined; and variation of the residual data is monitored over time. The residual data may be deconvolved based on known features of the substrate support.
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