Cryogenic electrostatic chuck

US11437261B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Yogananda Sarode Vishwanath · Bengaluru, IN
• Steven E. Babayan · Los Altos, US
• Stephen Prouty · San Jose, US
• Alvaro Garcia de Gorordo · Mountain View, US
• Andreas Schmid · Duisburg, DE
• Andrew Antoine NOUJAIM · معلمی نژاد, US

Key dates

• Filing date: Dec 11, 2018
• Grant date: Sep 6, 2022
• Expiry date: Jun 24, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68785
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a refrigerant channel disposed therein, and a facility plate having a coolant channel disposed therein. The facility plate includes a plate portion and a flange portion. The plate portion is coupled to the ESC base assembly and the flange portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the flange portion of the facility plate, and the seal assembly.