Computational metrology based correction and control
US11448973B2 · kind B2 · utility
1Cited by
2References
21Claims
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Key dates
| Filing date | Nov 20, 2018 |
| Grant date | Sep 20, 2022 |
| Priority date | — |
| Expiry date | Mar 2, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for determining a correction to a patterning process. The method includes obtaining a plurality of qualities of the patterning process (e.g., a plurality of parameter maps, or one or more corrections) derived from metrology data and data of an apparatus used in the patterning process, selecting, by a hardware computer system, a representative quality from the plurality of qualities, and determining, by the hardware computer system, a correction to the patterning process based on the representative quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.