Substrate processing systems, apparatus, and methods with factory interface environmental controls

US11450539B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Sushant S. Koshti · Sunnyvale, US
• Dean C. Hruzek · Cedar Park, US
• Ayan Majumdar · San Jose, US
• John C. Menk · Round Rock, US
• Helder Lee · San Jose, US
• Sangram Patil · Mountain View, US
• Sanjay Rajaram · Sunnyvale, US
• Douglas B. Baumgarten · Round Rock, US
• Nir Merry · Mountain View, US

Key dates

• Filing date: Aug 24, 2018
• Grant date: Sep 20, 2022
• Expiry date: Aug 24, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67772
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.