Integrated circuit package and method
US11502013B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2021 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | May 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.